Industrial Engineers

Job Description

Job Description: Fab Sort Manufacturing (FSM) is responsible for the production of all Intel silicon using some of the world's most advanced manufacturing processes with fabs in Arizona, Ireland, Israel, Oregon and two new greenfield sites in Ohio and Germany. Arizona's fab operation (OTF - Ocotillo Technology Fabrication) is recruiting lab engineering staff to conduct key analysis for the latest Intel technologies. This requisition is seeking an experienced TEM, FIB, dual-beam, SEM or static fault isolation analysis specialist. Responsibilities: - Operation and/or ownership of TEM/FIB/SEM tools to analyze defect, metrology, or failure analysis samples - Mentorship and training of FA team staff (technicians and engineers) on TEM/FIB/SEM - Knowledge and demonstration of the techniques of dual-beam or manual sample preparation for TEM/SEM - Preparing analysis plans and reports for customers on findings - Working with Yield and Process Engineering on rapid problem solving through directed analysis - Development of new techniques of preparation or analysis of samples in collaboration with vendors or TD

Qualifications

Minimum Qualifications:

Bacheors, Masters, or PhD in Materials Science, Physics, Engineering or related fields
2+ years of hands-on experience with TEM, FIB, or SEM instrumentation in a lab or applications setting
2+ years of experience in a lab setting where samples are prepared for analysis

Preferred Qualifications:

-Knowledge of semiconductor process fundamentals and the advances in fabrication technology over the past decade, possibly applied in a Foundry setting or at fabless company.
-Knowledge or direct experience with general failure analysis tools in a semiconductor laboratory, especially with nanoprobing, AFM, or other static optical/thermal isolation tools.
-Demonstrated independent quick-learning ability on lab instrumentation
-Excellent verbal and written communication skills
-Demonstrated ability to lead and manage lab staff
-Willingness to work skewed shifts covering weekends or evenings/nights as necessary
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $117,140.00-$165,370.00*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

Job Description

This commodity manager role is in the Wet Chemicals and Filters (WCF) team in Intel's Global Materials Organization (GMO) that drives the strategic sourcing and tactical/operational supply chain objectives for factory materials. As part of the Intel's Foundry Manufacturing and Supply Chain (FMSC) group, this team is responsible for managing the supply chain for fab materials to Intel factories at a global level.

The expectations and responsibilities for a commodity manager in this role are as follows, but not limited to:

Develops and executes commodity strategies, as well as drives supplier development through innovation and collaboration.
Maintains advanced knowledge of industry and market dynamics, and knowledge of commodities to drive supply chain solutions ahead of Intel's needs.
Leverages and applies strong understanding of contracting and negotiating, risk mitigation, and supplier relationship management to manage supplier relationships and provide sustainable cost, quality, availability, and technology solutions with adherence to procurement policies.
Owns relationships and coordinates purchasing activities with cross functional teams to acquire materials and services in a cost effective and timely manner.
Ensures that the respective commodity meets the business demand and cost requirements necessary for Intel to develop great products for its customers.
Works closely with partner teams and suppliers to define standard and custom product requirements, influence design decisions to meet desired product/service demand and fulfil the business objective.
Works with partner teams to capture commodity requirements and understand how design can influence cost and give feedback. Conducts periodic executive reviews of commodity sourcing strategy in partnership with internal teams/customers to shape strategic
business objectives and account investments through aligned roadmaps.
Reviews and pivots sourcing strategy when required in response to changing market conditions and develops mitigation plans to ensure business continuity.
Works closely with finance/legal to resolve disputes with suppliers/internal partners.
Leads sustainability and regulatory compliance and ensures suppliers comply with Intel's business processes.
Collaborates with internal and external stakeholders to drive supply chain optimization, understand affordability, set cost targets and define cost reduction roadmaps through detailed understanding of supplier's financial targets, business objectives, and margins.

Qualifications

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Candidate must possess a one of the following:

Bachelor's Degree in Supply Chain Management, Business Administration or in a relevant field with at least 4 years of experience in commercial supply chain strategy, contract and strategic negotiations and global supply chain management.
OR Master's Degree in Supply Chain Management, Business Administration or in a relevant field with at least 3 years of experience in commercial supply chain strategy, contract and strategic negotiations and global supply chain management.
This position is not open for Intel immigration sponsorship.

Preferred Qualifications:

Experience working in a manufacturing environment, preferably semiconductor manufacturing.
Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

US, Phoenix

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $106,300.00-$150,070.00*Salary range dependent on a number of factors including location and experience
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Description

About the Foundry Technology Development Group:

The Foundry Technology Development (TD) Group, the heart and soul of Moore’s Law at Intel, is responsible for the research, development, and deployment of next-generation silicon and packing technologies that will enable future Intel and Foundry customer products. The Logic Technology Development (LTD) team in TD, delivers programs and modules to ramp new process nodes, supports high volume manufacturing (HVM) and provides a predictable technology cadence for Intel customers.

About the Role:

As a DTCO Principal Engineer, you will play a critical role in optimizing processes technology and product design focusing on the technology pathfinding and definition phase. You will collaborate with cross-functional teams to drive technology definition maximizing process entitlement, while maintaining cost efficiency and manufacturability.

Responsibilities Include:

Lead design technology co-optimization efforts for new technologies.
Collaborate with process technology, design, and manufacturing teams to identify opportunities for device, process and design improvements.
Conduct feasibility studies and risk assessments to evaluate the options for process, device and design changes on technology entitlement for a node.
Utilize advanced modeling and simulation tools to analyze and optimize process features and designs for maximizing performance, and yield.
Develop and implement methodologies for iterative design and process optimization.
Provide technical leadership and mentorship to junior engineers and cross-functional teams.
Stay up-to-date with industry trends, technologies, and best practices related to design and manufacturing.
Communicate findings, insights, and recommendations to stakeholders and senior management.

Experience Required:

Strong understanding of design methodologies and process technologies.
Proficiency in simulation tools and software relevant to DTCO.
Excellent problem-solving skills and ability to analyze complex technical issues.
Strong interpersonal and communication skills, with the ability to work collaboratively in a team environment.
Proven ability to manage multiple projects and meet deadlines in a fast-paced setting.

Qualifications

Master’s degree in electrical engineering or similar field; PhD degree is preferred.
15+ years of experience in design optimization and manufacturing processes in the semiconductor industry.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Other Locations

US, OR, Hillsboro; US, TX, Austin; US, AZ, Phoenix; US, CA, Folsom; US, CA, San Diego

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $211,400.00-$298,440.00*Salary range dependent on a number of factors including location and experience
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.Position of TrustThis role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.

Job Description

Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundry's Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using some of the world's most advanced manufacturing processes. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy with Foundry Capability, Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond. This exciting transformation at Intel needs talented candidates with Process Integration, and Device engineering experience in Foundry to service local and global customers.

This job requisition is to seek an experienced Integration and Device engineer to join OTF to build a strong Yield engineering team including Integration and Device for Intel 18A technology to service global foundry customers. Candidates must possess strong Process integration knowledge which involves designing, developing, and optimizing the sequence of steps required for semiconductor devices, will work with various process technologies like lithography, etching, deposition, and chemical mechanical polishing. Experience and expertise in process integration, device engineering, and customer engineering are preferred.

As a Senior Process Integration Engineer, you may be responsible for but not limited to:

Providing technical support to customers for semiconductor products and processes, including design, yield, and performance issues, and drive solutions through collaboration with various Intel teams.
Troubleshooting issues related to semiconductor fabrication, including yield problems, process integration, and device performance.
Working with FEOL/BEOL Integration, Device, Defect Reduction, and Yield Analysis team members to identify the root cause of yield/performance issues and implement a mitigation plan in the defined timeline to meet committed production yield/performance targets and to support fast-paced yield ramp-up in high-volume manufacturing phases.
Owning NPI (New Product Introduction) in production fabs and perform product-specific process optimizations.
Work with cross-functional teams for engineering projects to improve product yield, quality, device performance, productivity improvement, and to reduce wafer cost.
Providing Engineering support for technical interactions with internal and external customers.
Project management by managing timelines and deliverables for multiple projects, providing regular updates and progress report.
Excellent communication skills, both verbal and written, with the ability to convey complex technical concepts effectively.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's Degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM relate Major.
5+ years of applied industrial experience in Semiconductor process integration, device physics, logic, architecture and integration, and interconnect development on leading-edge technology nodes.
Experience of foundry NPI activities and trouble-shooting tape-out issues with exceptional communication skills to communicate complex concepts, solutions, and strategic initiatives.
Experience with IC wafer fabrication process engineering, manufacturing systems, semiconductor materials, and wafer test (e.g., fabrication areas may include photolithography and advanced patterning, thin film deposition, planarization, defect metrology, or spectroscopy).
Experience interpreting product data including inline, e-test, and SORT data, finding failure root cause and inline indicators, and driving for solutions.

Preferred Qualifications:

Post graduate degree in Electrical Engineering, Physics, Chemistry, Materials Science or in a STEM relate Major.
5+ years of applied industrial experience in Semiconductor process integration, device physics, logic, architecture and integration, and interconnect development on leading-edge technology nodes.
Work in 3nm-16nm FinFET and sub 3nm GAA
Experience in Yield Improvement and High-Volume Manufacturing
Experience with Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, test structure design, device modeling, and electrical characterization.
Experience with eight disciplines (8D) model, process control standards, FDC and SPC response strategy. Leading teams through end-to-end process and working knowledge and application of internal and external industry-standard audits and fully own compliance closure activities.
Ability to work across organizational boundaries using a structured problem-solving methodology to resolve process-related problems, quality improvement/tool improvement/ cost improvement actions.
Demonstrated experience managing the balance between foundry and customer needs. Direct experience working with external customers. Familiarity with industry standards and certifications.
Requirements listed would be obtained through a combination of industry-relevant job experience, internship experiences, and or schoolwork/classes/research. The specific duties and requirements for a Foundry engineer can vary depending on the complexity of the customers' projects. However, the role is crucial in ensuring customer satisfaction and the successful delivery of customer products.
#Foundry, #Integration, #Device

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $136,990.00-$193,390.00*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.
Apply

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Job Description

Intel Chandler, Arizona Ocotillo Technology Fabrication (OTF) is part of Intel Foundry's Manufacturing and Supply Chain group (FMSC) and is responsible for the high-volume production of Intel silicon using some of the world's most advanced manufacturing processes. As part of Intel's Integrated Device Manufacturer 2.0 (IDM2.0) strategy with Foundry Capability, Intel Chandler, Arizona site is building new fabs for the latest technology nodes including Intel 18A and beyond. This exciting transformation at Intel needs talented candidates with Device engineering experience in Foundry to service local and global customers.

This job requisition is to seek an experienced Device engineer to join OTF to build a strong Yield engineering team including Integration and Device for Intel 18A technology to service global foundry customers. Candidates must possess strong CMOS Device knowledge with experiences in the generation and analysis of device parametric data, design of experiment (DOE) principles, and engineering data analysis tools. The role is focused on CMOS device technology with embedded features to support a range of applications and will work closely with a team of engineers to push the boundaries of device performance, power efficiency, and scaling.

As a Senior Device Engineer, you may be responsible for but not limited to:

Collaborate with the manufacturing team to develop and refine fabrication processes that meet device specifications and yield targets.
Collaborate with the Development team to develop new device technology and customize newly developed device architectures to customer needs.
Develop CMOS logic device technologies with embedded features for various foundry customer use in a large-volume manufacturing environment.
Drive the development and implementation of customized semiconductor device technologies, ensuring compatibility with Intel's existing manufacturing processes and platforms.
Demonstrated expertise in CMOS semiconductor device physics and fabrication of advanced transistor device architectures.
Owning NPI (New Product Introduction) in production fabs and perform product-specific device characteristics optimizations and DOE.
Proficiency in data analysis, scripting, and data analytic techniques to accelerate learning.
Strong technical problem-solving skills and excellent communication skills, with the ability to convey complex technical concepts effectively.
Ability to work collaboratively in a globally diverse, cross-disciplinary team to develop innovative device solutions on an aggressive schedule.
Project management by managing timelines and deliverables for multiple projects, providing regular updates and progress report.
Excellent communication skills, both verbal and written, with the ability to convey complex technical concepts effectively.
Provide technical guidance and mentorship to junior device engineers, fostering a strong culture of continuous learning and development.
Desire to learn, lead, and influence cross-functional teams.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor's Degree in Electrical Engineering, Physics, or related field of study with 5+ years or a Master's degree with 3+ years of experience in CMOS device engineering, device physics, logic, architecture, and interconnect development on leading-edge technology nodes.
Experience in advanced CMOS device technology, preferably in a foundry environment.
Experience of foundry NPI activities and trouble-shooting tape-out issues with exceptional communication skills to communicate complex concepts, solutions, and strategic initiatives.
Experience with IC wafer fabrication process engineering, manufacturing systems, semiconductor materials, and wafer test (e.g., fabrication areas may include photolithography and advanced patterning, thin film deposition, planarization, defect metrology, or spectroscopy).
Experience interpreting product data including inline, e-test, and SORT data, finding failure root cause and inline indicators, and driving for solutions.

Preferred Qualifications:

Post graduate degree in Electrical Engineering, Physics, or related field of study with 5+years of experience in CMOS device engineering.
Hands-on experience in advanced node semiconductor technology device development.
Experience working on in 3nm-16nm FinFETs and sub 3nm GAA FETs.
Experience in a High-Volume Manufacturing environment.
Experience with Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, test structure design, device modeling, and electrical characterization.
Demonstrated experience managing the balance between foundry and customer needs. Direct experience working with external customers. Familiarity with industry standards and certifications.
Requirements listed would be obtained through a combination of industry-relevant job experience, internship experiences, and or schoolwork/classes/research. The specific duties and requirements for a Foundry engineer can vary depending on the complexity of the customers' projects. However, the role is crucial in ensuring customer satisfaction and the successful delivery of customer products.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $136,990.00-$193,390.00*Salary range dependent on a number of factors including location and experience
Working Model
This role will require an on-site presence.* Job posting details (such as work model, location or time type) are subject to change.

Business Line Description:

Front End Operations plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a winning advantage for our customers.

Job Summary:

The ETCH Process Engineer is responsible for multiple processes in a high-volume manufacturing facility. Engineer will be responsible for identifying and reducing sources of variation, implementing zero defect processes, and supporting development or transfer activities.

Responsibilities:

• Reducing defectivity/scrap

• Reducing cycle time

• Improving tool utilization and availability

• Identification and reduction of recurrent machine faults

• Reducing cost

• Supporting development activities

• Developing and writing specifications

• Implementation of Six-Sigma statistical process control methods

• Capacity planning and modeling

• Participating in and/or leading cross-functional and lean activity teams

Qualifications:

• BS in an engineering discipline

• 3-5 years experience in process engineering in a high-volume semiconductor manufacturing environment

• Ability to generate, analyze, and interpret equipment and process performance data and produce a timely action plan to resolve recurring failures

• Demonstrated presentation skills. Candidate will be called upon to train others and present complex datasets and process problems/ solutions to diverse audiences.

• Competent in troubleshooting problems and capable of applying logic to isolate and repair them.

• Ability to deal with multiple issues and shifting priorities.

• Strong verbal and written communication skills.

• Ability to interact professionally with manufacturing and equipment engineering to deal with these issues and priorities.

• Good foundational problem-solving skills with creative solutions and out-of-the-box thinking.

• Self-motivated; able to take initiative and effectively prioritize work for self.

• A strong desire to help create a positive, winning, world class working environment.

• Previous experience in Lean Manufacturing methods is highly desirable.

• Previous experience in at least one or more of the following tools/processes preferred:

Applied Materials Centura MxP/MxP+/DPS
LAM 4500
ULVAC Enviro II
Gasonics 3500 Asher
More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

#LI-56ed

NXP’s Front End Operations plays an essential role in the company’s success by ensuring manufacturing excellence and delivery of high quality, scalable, and cost-competitive semiconductor devices to create a winning advantage for our customers.

Job Summary:

Engineering Technician responsible for Diffusion/Cleans in a high-volume manufacturing facility. The position will be responsible for but not limited to the following:

Identification and reduction of recurrent machine faults
Reduce defectivity
Developing and writing specifications
Improving tool utilization and availability
Train technicians and peers
Improve cost performance
Specify, source, and qualify new equipment and parts
Participate on and/or lead cross functional teams
Support development and transfer activities
Reducing cost
Reducing scrap / Improving yield
Reducing cycle time
Improving tool utilization and availability

Key Challenges:

Ability to work in a high volume 24x7 manufacturing environment
Ability to work individually, in small work groups or larger teams
Ability to deal with multiple issues and shifting priorities
Must be self-motivated; able to take initiative, self-generate projects, and effectively prioritize work
Willing to adjust work schedule as needed to support factory priorities 24x7
Be responsible for multiple tools across multiple platforms
Cross functional aspects:
Work with Maintenance, Manufacturing, Facilities, Analytical Laboratory and Device Engineering Teams
Work with peers in other factories to implement Best Known Methods (BKM’s)

Job Qualifications:

Associate degree or higher in engineering or science is required or comparable number of years of work experience
5+ years previous applicable high volume semiconductor manufacturing experience is desirable
Previous experience on a combination of the following processes/equipment is highly desirable
Furnaces - VTR7000, AVP8000, TEL Alpha
Wet Benches - SCP9400, Screen WS-820L
Cleaning Systems – Semitool SST, SAT Raider, Screen 80B/Nanospray
Ability to generate, analyze, and interpret equipment and process performance data and produce a timely action plan to resolve recurring failures
Strong problem-solving skills
Strong verbal and written communication skills
A desire to work in a team environment and to create a positive work environment
Good knowledge of Diffusion/Cleans processes and equipment
Good knowledge of Statistical Process Control (SPC)
Good knowledge of Fault Detection and Classification (FDC)
Good knowledge of Lean principles and Lean Manufacturing techniques
Good knowledge of FMEA’s and 8D methodologies

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

#LI-97b2

Quality Inspector

#7118 | Posted 03/23/2025
Chandler, Arizona, United States
Apply
Job Description
Mechanical Inspector – Advantest

Who We Are…

Advantest is leveraging Industry 4.0 to bring together Innovation, Cutting-Edge Technology, Machining Automation, and Smart Manufacturing as we revolutionize the semiconductor industry. Our newly built 200,000 sf facility in Chandler, Arizona is just one example of how Advantest is leading the way in precision.

Job Summary:

This job requires precision inspection of machined parts. As a Mechanical Inspector, you will be responsible for ensuring the quality and accuracy of our mechanical components and products in maintaining our high standards of excellence. Your experience in quality assurance and precision measuring instruments will be essential to our success.

Job Responsibilities:

• Responsible for performing Quality Control Inspection of precision-made plastic and metal parts from mechanical drawings.
• Measure products with Hand-tools; Calipers, Gauges, Dial Indicators, Micrometers, Profilometers,
• Height Gauges, and Go-No/Go Gauges etc.
• Discuss inspection results with those responsible for products.
• Collect data/assist QA-QC team in collecting data for experiments.

Requirements

Job Requirements:

• Be able to use (or will to be trained) on automated metrology equipment such as AOI, CMM.
• Minimum of 1-3 years of experience in mechanical inspection of machined parts is desired.
• Ability to read and understand mechanical drawings.
• Be able to read and understand GD&T symbols.
• Experience in using QC bench tools is required (Calipers, Micrometers, Gage Blocks, Gage Pins, etc.).
• Able to use Microsoft Office (Word, Excel, Outlook).

Our Benefits:

• Competitive base pay + Eligibility for the Advantest Global Bonus which can be up to 30% of your annual pay *paid out biannually
• Comprehensive medical insurance programs that start on DAY ONE of employment
• Four different Cigna medical plans to choose from
• Dental (Cigna) and Vision (VSP)
• Personalized Mental Wellness services through Lyra Health advantest.lyrahealth.com
• Health Savings Account (HSA) *for eligible plans
• Flex Spending Account (FSA) *Health & Dependent Care or Limited Purpose FSA
• Company paid Basic Life/AD&D *buy-up options available
• Company paid Base Long-Term Disability (LTD) Insurance * buy-up options available
• Employee Assistance Program (EAP)
• Pet, Auto, Home Insurance *optional/buy-up
• 401(k) with dollar-for-dollar employer matching up to 7% of your annual salary
• 15 Days’ PTO + 12 paid holidays per year

Target Salary Range

$28/hour to $32/hour + Overtime + Bonus
Additional Information
EEO Statement Advantest is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of Advantest to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.
Locations
Chandler, Arizona, United States
Field of Activity
Quality
Position Type
Regular

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

Join our team—no experience needed! We offer comprehensive training for all new employees. The ideal candidate for this role must have strong computer and communication skills, a team-oriented individual who demonstrates punctuality, reliability, and is eager to learn, adapts to change, and embodies TSMC’s core values – Integrity, Commitment, Innovation, and Customer Trust.

Responsibilities:
As a Manufacturing Specialist, you will be:
Working in our Manufacturing Command Center (MCC) using intelligent systems to drive the automated activities on the production floor.
Some duties require working in our clean room environment, where you will wear a clean room garment (protective eyewear, gloves, a hood, and a mask) to protect the wafers from outside particles.
Learn and become familiar with manufacturing/engineering process and stay informed of any changes in procedures.
Work with supporting module on actions to bring the process/tools back to baseline.
Able to handle time sensitive material in a safe and efficient manner
Ability to perform various tasks in a disciplined manner in accordance with SOPs (Standard Operation Procedure), and report problems to supervisors. Assist in creating training or SOP documents.
Monitor different integrated systems to ensure the automated tools are running properly and assisting in handling of abnormal events that occur in production.
Train new members to the team once skill level reach a certain level in the team.
Regular attendance and reliability for this position is critical
Must be able to perform the duties of the job with or without a reasonable accommodation.

Minimum Qualifications/Requirements:
Applicants must be legally eligible to work in the United States
High school Diploma or GED required.
Must be computer literate with proficiency in Microsoft Word, Excel, Outlook, and PowerPoint.
Typing speed of at least 25 words per minute.

Physical Requirements:
Specific vision abilities required by this job includes the ability to adjust focus, good eyesight with color differentiation, with or without vision correction.
Ability to stand and/or walk for a 12-hour shift, bending, pushing carts, & capable of lifting up to ~20 pounds in the clean room environment with or without a reasonable accommodation.
Work in a clean room environment wearing proper clean room garments (full cleanroom suit, protective eyewear, gloves, hood, and mask)
Must be able to work with computers extensively while remaining sedentary in an office environment throughout the shift.

Shift expectations:
TSMC Arizona operates 24/7, 365 days a year. This position requires candidate to have ability and willingness to work any shift (day or night) in a compressed work week schedule once training is done. The compressed work week shift structure is Work 4 days on, 3 days off for one week and 3 days on, 4 days off the next week. Shift is 12 hour shifts from 6am to 6pm or 6pm to 6am. Note: Training period schedule for the first few months can vary in schedule based on available training resources.

Candidates must be willing and able to work on-site at our Phoenix Arizona facility.

As a valued member of the TSMC family, we place a significant focus on your health and well-being. When you are at your best-physically, mentally, and financially-our company is at its best. We offer a comprehensive and competitive benefits program that provides the resources you need to help you manage your health and achieve your goals across many areas of your life. This includes a variety of medical, dental and vision plan offerings you can choose from that best fit your and your family’s needs. Additionally, TSMC provides income-protection programs to financially assist you should you experience an injury or illness, and a 401(k)-retirement savings plan to help you secure your financial future. TSMC also offers competitive paid time-off programs and paid holidays allowing you to recharge and spend time with your family and loved ones.

Work Location: 5088 W. Innovation Circle, Phoenix, AZ 85083

Project Scope:
Collaborate with Process Engineers on Kaizen improvement projects focused on enhancing efficiency, safety, and precision in PCB laminate manufacturing. Interns will gain hands-on experience applying Lean Manufacturing and Six Sigma principles to optimize processes and equipment.

What You’ll Do:

Lead Kaizen projects to improve manufacturing efficiency and safety

Optimize performance of laminate Cutter F & G and collation turntable

Apply Lean and Six Sigma practices for continuous improvement

Key Responsibilities:

Identify inefficiencies and implement workflow improvements

Conduct time studies and validate efficiency metrics

Troubleshoot precision and throughput issues in cutting operations

Develop and test process improvements using quality control tools

Collaborate with Manufacturing, Quality, and Maintenance teams

Present findings and recommendations to leadership

Ideal Candidates Are:

Pursuing a degree in Mechanical Engineering, Industrial Engineering, or a related field

Experienced in hands-on troubleshooting and process optimization

Knowledgeable in Lean Manufacturing, Six Sigma, and equipment improvement

Independent and proactive

Compensation:

Bachelor’s Level: $22–$24/hr

Master’s Level: $25–$28/hr

PhD Level: $28–$32/hr

How to Apply:
Submit your resume and a short statement of interest at: www.isola-group.com